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      Product Process
Item Arameter
Single Side Double Side Multilayer
Base Material Metal substrates Metal substrates Metal substrates
Board Thickness 0.25mm-4.0mm 0.30mm-4.0mm 0.40mm-5.0mm
Layers 1 2 4-8
Copper Foil Thickness 18-175 цm ( Standard 18цm35цm70цm
Peel Strength 1.25N/mm 1.25N/mm 1.25N/mm
Insulation Resistance −10KΩNormal
Electric Strength −1.4KV/mm
Flame Resistant 94HB/94V0 94V-0 94V-0
Min.punch Hole Size 0.9mm/35mil
Min.drill Hole Size 0.25mm/10mil 0.25mm/10mil 0.25mm/10mil
Hole Size Tolerance +φ0.8mm\0.05mm
Hole location Tolerance \0.05mm
PTH Wall Thickness −2um/0.8mil −2um/0.8mil
Hole Resistance +300цΩ +300цΩ
Min. Line Width 0.127mm/5mil 0.127mm/5mil 0.127mm/5mil
Min.Space 0.127mm/5mil 0.127mm/5mil 0.127mm/5mil
Surface Treatment HALElectroness Au , OSP, Chemical Au, Immersion Gold
Bow And Twist +1% +1% +1%
Min.Unit Area 4mmX6mm 4mmX6mm 10mmX10mm
Max.Unit Area 1200mmx600mm 610mmX510mm 500mmx450mm
Profile Tolerance \0.15mm(Routing) \0.15mm(Routing) \0.15mm(Routing)
V-cut 30 < / 45 < / 60<
Soldermask Abrasion −4H −6H −6H
Solder Mask Type Liquid photosensitive solder resist oil, heat-curing solder oil, UV
Solderability 260≧\5≧ / 10 Second / 3 Time
QC Criterion GB4588.2GB4588.4IPC600EIPC-A-600FIPC-ML-950
Pcb Files Type Protel, Gerber File , Powerpcb, Pcad, Autocad,Orcad, Cam350,
 

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